HyperCLEAN III

The HyperCLEAN III is a high-capacity defluxing machine designed for low-mix production environments. It is positioned as an effective solution for processes where cleaner and flux combinations are well matched.

  • Application: PCB Assemblies
  • Capacity: High Batch Volume
  • Contamination Solubility: Easy to Hard
Technical Features of HyperCLEAN III
Cleaning Machines Overview HyperCLEAN III
Usable chamber size: W x L x H [mm] (W=left-right, L=front back, H=height) 780 x 1200 x 810
Usable space for standard clamping: W x L x H [mm](W=left right, L=front back, H=height) Combo 1 Short: 700 x 700 x 300 Combo 2 Short: 2 x 700 x 700 x 300 Combo 1 long: 700 x 1000 x 700
PCBA, HDI, DC, BGA, PoP, SIP CSP, BTC, QFN, MELF hybrids, etc.
Eurocards (100 x 160 mm) [pcs per cycle] 128
Cycle time [minute] 40-60
Metal & Plastic stencils (paste, glue) X
Stencils [pcs per cycle] X
Cycle time [minutes] X
Maintenance parts from soldering process (solder pallets, filters, carrier, etc.)
Solder pallets [pcs per cycle] 500 x 500 x 40 mm (other sizes optional) 11 - 22
Cycle time [minute] 35-60
Cleaning agent volume (Ready-to-use) 114 L
Max. cleaning temperature 60°C
Max. rinsing temperature 60°C
Max. drying temperature 110°C
Machine dimensions W x L x H [mm] (W=left-right, L= front-back, H = height) * height with opened door Short : 1700 x 3200 x 2500 Long : 1500 x 3510 x 2500 (incl. pushcart)
Machine weight without liquid 1200 - 1500 kg
Product Brochure of HyperCLEAN III

Download the product brochure of HyperCLEAN III to learn about its key features, technical structure, and application areas.

Product Video
HyperCLEAN III

This product video introduces HyperCLEAN III by summarizing its general working principle and typical application scenarios.

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