SuperSWASH III

The SuperSWASH III is designed for customers seeking top-level cleaning performance without requiring automation or extremely high throughput. It is positioned as an optimal solution for medium to low production volumes of complex products that demand precise and thorough cleaning.

  • Application: High Density SMD Assemblies
  • Capacity: Low to Medium Volume
  • Contamination Solubility: Easy to Hard
Technical Features of SuperSWASH III
Cleaning Machines Overview Single Twingo
Usable chamber size: W x L x H [mm] (W=left-right, L=front back, H=height) 835 x 80 x 815 or 835 x 150 x 815 2 x 835 x 50 x 740
Usable space for standard clamping: W x L x H [mm](W=left right, L=front back, H=height) 740 x 80 x 772 or 740 x 150 x 772 2 x 740 x 50 x 695
PCBA, HDI, DC, BGA, PoP, SIP CSP, BTC, QFN, MELF hybrids, etc.
Eurocards (100 x 160 mm) [pcs per cycle] 20 40
Cycle time [minute]
Metal & Plastic stencils (paste, glue) 1 2
Stencils [pcs per cycle] 7 7
Cycle time [minutes]
Maintenance parts from soldering process (solder pallets, filters, carrier, etc.)
Solder pallets [pcs per cycle] 500 x 500 x 40 mm (other sizes optional)
Cycle time [minute] 80L/57L (II/III) 80L/57L (II/III)
Cleaning agent volume (Ready-to-use) 80L 80L
Max. cleaning temperature 60°C 60°C
Max. rinsing temperature 40°C 40°C
Max. drying temperature 110°C 110°C
Machine dimensions W x L x H [mm] (W=left-right, L= front-back, H = height) * height with opened door 1700 x 1500 x 2450 1700 x 1500 x 2450
Machine weight without liquid 570-630 kg 570-630 kg
Product Brochure of SuperSWASH III

Download the product brochure of SuperSWASH III to learn about its key features, technical structure, and application areas.

Product Video
SuperSWASH III

This product video introduces SuperSWASH III by summarizing its general working principle and typical application scenarios.

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