MiniSWASH III

The MiniSWASH III is positioned as a cost-effective cleaning solution for users who do not require daily PCBA cleaning. It is suited for environments such as research and development centers, prototyping facilities, start-ups, and very low-volume production operations, where consistent cleaning results are required at smaller scales.

  • Application: Standard SMD Assemblies
  • Capacity: Small Volume
  • Contamination Solubility: Easy to Moderate
Technical Features of MiniSWASH III
Cleaning Machines Overview MiniSWASH III
Usable chamber size: W x L x H [mm] (W=left-right, L=front back, H=height) 810 x 60 x 740
Usable space for standard clamping: W x L x H [mm](W=left right, L=front back, H=height) 740 x 60 x 695
PCBA, HDI, DC, BGA, PoP, SIP CSP, BTC, QFN, MELF hybrids, etc.
Eurocards (100 x 160 mm) [pcs per cycle] 20
Cycle time [minute] 20-40
Metal & Plastic stencils (paste, glue)
Stencils [pcs per cycle] 1
Cycle time [minutes] 10
Maintenance parts from soldering process (solder pallets, filters, carrier, etc.)
Solder pallets [pcs per cycle] 500 x 500 x 40 mm (other sizes optional)
Cycle time [minute]
Cleaning agent volume (Ready-to-use) 62 L
Max. cleaning temperature 60°C
Max. rinsing temperature 40°C
Max. drying temperature 90°C
Machine dimensions W x L x H [mm] (W=left-right, L= front-back, H = height) * height with opened door Open loop: 1600 x 850 x 1200/1600 Closed loop: 1600 x 1400 x 1200/1600 (w/wo signal tower)
Machine weight without liquid 250-450 kg
Product Brochure of MiniSWASH III

Download the product brochure of MiniSWASH III to learn about its key features, technical structure, and application areas.

Product Video
MiniSWASH III

This product video introduces MiniSWASH III by summarizing its general working principle and typical application scenarios.

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