The system is compatible with real-time HD photography for both tall components and small materials. By adjusting the Z-axis height for specific devices within a particular FOV, the image quality of screen printing is significantly improved. It offers compatibility for devices with a height of up to 25mm.

The integration of multi-angle projection and multi-frequency fringe structured light fusion addresses image overexposure issues. This process incorporates an AI intelligent denoising function to highly restore the 3D image of the measured object, providing precise 3D data.

By evaluating the solder climbing state, the sectional area, size, and angle are measured to minimize imaging impact on the measurement process. This method effectively facilitates the detection of defects such as spot welding, insufficient tin, and excess tin.