PCO 1300
A fully automatic pressure curing oven featuring 300 mm EFEM integration for streamlined handling.
✔ Oven Size (mm): 2,200 (W) × 2,200 (D) × 2,475 (H)
✔ Usable Chamber Area (mm): 560 (W) × 680 (D) × 480 (H)
✔ Max Operating Pressure: 20 bar (290 psi)
✔ Max Operating Temperature: 260°C
✔ Optional features include nitrogen capability, Cleanroom Class 100 compliance, and vacuum down to 5 Torr.
✔ Supports fully automatic loading via EFEM for 300 mm wafers.
Building on our innovations in SMT solder reflow, including full-convection technology and efficient nitrogen usage, we now offer a complete family of custom pressure curing and reflow ovens designed for a wide range of pressure-based applications.
Heller provides multiple pressure curing oven models with various chamber sizes suitable for R&D environments and high-volume production, with optional cleanroom and automation configurations.
✔ These systems maintain constant chamber pressure while heated air (or nitrogen) circulates through a convection heater module.
✔ The high-reliability fan motor moves heated air continuously across the pressure chamber to deliver uniform thermal processing.
✔ An optional vacuum pump can be added to improve void removal.
✔ Vacuum is applied at the beginning of the curing cycle to eliminate larger voids, while smaller voids are removed later under pressure.
✔ Using both vacuum and pressure can help achieve shorter cycle times.
| Feature | PCO 1300 |
|---|---|
| Oven Size (mm) | 2,200[W] x 2,200[D] x 2,475[H] |
| Chamber Usable Area (mm) | 560[W] x 680[D] x 480[H] |
| Max Operating Pressure | 20 bar (290 psi) |
| Max Operating Temperature | 260⁰ C |
| Nitrogen Enabled | (option) |
| Cleanroom Class 100 | (option) |
| Vacuum down to 5 Torr | (option) |
| * | Fully Automatic Loading with EFEM (300mm wafer) |
This product video introduces PCO Series by summarizing its general working principle and typical application scenarios.
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