PCO 1150
A manual-load Pressure Curing Oven (PCO) designed for PLP panel curing, offering reliable performance and controlled processing.
✔ Oven Dimensions (mm): 2,000 (W) × 2,300 (D) × 2,300 (H)
✔ Max Operating Pressure: 10 bar (145 psi)
✔ Max Operating Temperature: 220°C
✔ Supports Nitrogen / CDA environments and meets Cleanroom Class 1000
✔ Provides vacuum capability down to 10 Torr.
✔ Configured for manual loading of PLP panel magazines with 1-magazine capacity.
Building on our innovations in SMT solder reflow, including full-convection technology and efficient nitrogen usage, we now offer a complete family of custom pressure curing and reflow ovens designed for a wide range of pressure-based applications.
Heller provides multiple pressure curing oven models with various chamber sizes suitable for R&D environments and high-volume production, with optional cleanroom and automation configurations.
✔ These systems maintain constant chamber pressure while heated air (or nitrogen) circulates through a convection heater module.
✔ The high-reliability fan motor moves heated air continuously across the pressure chamber to deliver uniform thermal processing.
✔ An optional vacuum pump can be added to improve void removal.
✔ Vacuum is applied at the beginning of the curing cycle to eliminate larger voids, while smaller voids are removed later under pressure.
✔ Using both vacuum and pressure can help achieve shorter cycle times.
| Feature | PCO 1150 |
|---|---|
| Oven Size (mm) | 2,000[W] x 2,300[D] x 2,300[H] |
| Max Operating Pressure | 10 bar (145 psi) |
| Max Operating Temperature | 220⁰ C |
| Gas / Air Type | Nitrogen / CDA |
| Cleanroom Standard | Class 1000 |
| Vacuum Capability | Down to 10 Torr |
| Loading Type | Manual Loading (PLP Panel Magazine) |
| Capacity | 1 Magazine Capacity |
This product video introduces PCO Series by summarizing its general working principle and typical application scenarios.
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