The VP6100 is equipped with patented Multi Vacuum Technology. This reduces voids in solder joints and achieves void rates of <1%. The vacuum module, which can be switched on during the process, is located outside the soldering area (Clean Vacuum Technology) and therefore requires very little maintenance.
Maximum flexibility and optimum soldering quality are essential features of ASSCON stand-alone vapor phase soldering systems. By using workpiece carriers, these systems are excellently suited for small and large production quantities as well as for any design and size of assemblies.
Due to their compact design, multi-chamber systems can find a place in almost any production environment. The conception as batch systems allows island production. In this way, the system can be fed from a wide variety of production stations.
| Features | VP1100 | VP6100 Vacuum |
|---|---|---|
| Workpiece carrier format | 610 x 610 mm | 600 x 600 mm |
| Maximum solder height | 60 mm | 60 mm |
| Maximum transport clearance | 100 mm | 100 mm |
| Power Supply | 400 V / 3 / N / PE 50 Hz | 400 V / 3 / N / PE 50 Hz |
| Connection Load | 9,2 kW | 13,4 kW |
| Average energy consumption | 3,3 kWh | 3,7 kW |
| End vacuum (pump) | — | 0,5 mbar |
This product video introduces VP6100- Vacuum by summarizing its general working principle and typical application scenarios.
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