AMI AW Series
✔ The AW Series wafer inspection system offers better than 5 micron sensitivity and throughput up to 2x faster than competing systems. With non-immersion Waterfall transducers, it eliminates false positives caused by DI water, ensuring accurate and reliable wafer inspection.
✔ The AW Series automated wafer inspection system automatically handles, inspects, and sorts wafers using user-defined accept/reject criteria. It supports wafer-level products such as BSI sensors, SOI, MEMS, LEDs, Chip-on-Wafer, and unpolished wafers, regardless of bonding process (fusion, anodic, glass frit, epoxy).
| Feature | AMI AW Series |
|---|---|
| Waterfall transducers | Used for non-immersion scanning / Minimizes risks and fast bond indicators |
| Loadports | 300 mm FOUP or FOSB carriers / 200 mm SMIF pods / Open cassettes from 100 mm to 150 mm |
| - | 500 MHz bandwidth pulser/receiver |
| - | Ultra-high resolution transducers |
| Auto analysis software to determine: | Percent bond or disbond / Void size and count / Auto accept/reject based on user-defined criteria |
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