The standard 4000Plus mainframe has a vertical working envelope of 120mm, which meets the demands of most applications. XY stages are available from 160mm x 160mm up to 300mm x 210mm, including options for high precision, higher speed, and zone shear. Additionally, a heated work stage operating up to 400°C at 200kg maximum load is available with adjustable temperature control.

The industry-unique multi-function cartridges (MFCs) are designed for automated test routines on the 4000Plus bondtester. These components enable multi-surface test patterns for complex hybrid packages while facilitating rapid application changeover.

Current and emerging applications are fully supported by load cartridges combined with standard and specialized fixtures. This setup performs shear tests up to 500kg, pull tests up to 100kg, and push tests up to 50kg.

Ribbon pull – With an extensive range of load tools including hooks and tweezer jaws, all sizes and types of ribbons can be tested. 

Hot bump/pin pull – A new load cartridge makes this groundbreaking test even better, especially for evaluating PCB substrate materials and low profile solder bumps. 

First bond ball pull of copper wires and pull of studs, bumps and pillars – For the first time custom pull jaws enable tensile tests on these important interconnects. 

Passivation layer shear – A combination of software and a special load tool provides a solution to ball shear where access is limited by the passivation layer.

Image capture system for advanced analysis is quick to set-up and in close proximity to the test head aiding faster testing. 

Trinocular camera can be attached to any stereo zoom microscope with a C-mount. With an appropriate microscope, the field of view can be adjusted from wide to close up and is ideally suited for macro positioning.

The new high-speed cameras provide high resolution images and elevate the throughput. It is compatible with all Nordson bond tester imaging systems.