AXI XS

Test & Control & Inspection | X-Ray Inspection Systems

AXI XS

✔ 3D Inspection uncovers remarkable details for Nordson’s Zero Defects approach.

✔ Dynamic Planar CT is the advanced software for the upcoming generation of 3D planar X-ray inspection which elevates AXI to the next stage.

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Technical Features

Installation	AXI XS Series
System Dimensions (H, W, D)	1760 × 1300 × 1600 mm
Conveyor Height (SMEMA)	950 mm ± 30 mm
System Mass	2500 kg
Safe Operating Temperature Range	15-32°C, optimal 20-25°C
Max. Power Consumption	2 kVA
Air Supply	5-7 Bar, <2 l/min, filtered (30 µ), dry, oil free
Line Voltage	400 VAC, 50/60 Hz 3 Phase, 16 A 208 VAC, 50/60 Hz 3 Phase, 25 A
Clean Room Options	ISO6 And ISO7

X-ray Imaging Chain

Feature	Semiconductor	Semiconductor Pro Strip	Semiconductor Pro Tray
Microfocus X-ray Source (sealed tube)	100 kV, 20 W	160 kV, 20 W	160 kV, 20 W
Detector	Aspire CMOS FPD	Aspire CMOS FPD	Aspire CMOS FPD
Detector Pixel Pitch	50 µm	50 µm	50 µm
Detector Active Area	120 × 140 mm, 2400 × 2782 pix	120 × 140 mm, 2400 × 2782 pix	120 × 140 mm, 2400 × 2782 pix
Detector Max. Frame Rate	25 fps	25 fps	25 fps
Detector Bit Depth	14-bit / 16-bit	14-bit / 16-bit	14-bit / 16-bit

Max. Inspection Speed

Feature	Semiconductor	Semiconductor Pro Strip	Semiconductor Pro Tray
Transmission (2D)	6 views/sec	6 views/sec	-
Off-Axis (2.5D)	5 views/sec	5 views/sec	-
Dynamic Planar CT (3D)	3 sec/FoV	3 sec/FoV	3 sec/FoV

Inspection Parameteres

Feature	Semiconductor	Semiconductor Pro Strip	Semiconductor Pro Tray
Max. Sample Size (L × W)	330 × 200 mm	330 × 150 mm	330 × 200 mm
Max. Inspection Area (L × W)	330 × 200 mm	330 × 145 mm	330 × 200 mm
Min. Sample Size (L × W)	80 × 20 mm	80 × 20 mm	80 × 50 mm
Max. Sample Mass	0.3 kg	0.3 kg	2 kg
Max. Inspection Angle	30°	30°	30°
Max. Resolution (2D, 3D)	<3 µm/pix, <3 µm/vox	<0.8 µm/pix, <0.8 µm/vox	<1 µm/pix, <1 µm/vox