Smart-Sized Modular Pick-and-Place
Strong, Flexible, Adaptive & Modular
Fox Series
Experience the Fox, a compact, high-performance Pick & Place system designed for all component and device types.
Expandable in every direction, the Fox platform supports up to 200 feeders, demonstrating exceptional capability in high-mix electronic production.
Thanks to its small footprint and lightweight design, the Fox machine is perfectly suited for space-constrained production environments, including upper-floor facilities where flexibility and efficiency are essential.
✔ Placement and dispensing are combined in a single pass-through operation, allowing jet dispensing of solder paste or adhesive glue for seamless integration and efficiency.
✔ Achieve 9,100 – 31,000 components per hour (cph) per module, with exceptional valve performance up to 1,100,000 dots/h and a system average of 350,000 dots/h, ensuring high-speed and consistent throughput.
✔ Supports up to 200 feeder lanes per square meter and up to 420 feeder lanes per line, providing maximum productivity within minimal floor space.
✔ Built with symmetric mineral casting for vibration-free operation, eliminating warpage and thermal drift for long-term mechanical stability.
✔ Designed for nonstop production using intelligent smart feeders, enabling continuous feeder replacement and instant product changeovers without downtime.
✔ Equipped with fast and reliable dual-drive linear motors, offering maintenance-free operation and the longest lifetime in its class.
For your optimal benefit, we have various product notes available for our optional equipment. Please contact your local consultant or our service team. Essemtec solutions are unique in the industry and characterized by fast and uncomplicated adaptation to general conditions and customer requirements.
Advanced, fully graphical interface with a 21.5” 16:9 HD wide touchscreen designed for intuitive fingertip control. Supports universal CAD conversion, enables zoom functionality within camera windows, and integrates all-in-one job planning and setup optimization. Includes stock management, ERP/MES connectivity, data analysis, and line management capabilities.
Designed for integration into high-speed lines and highly complex dispensing applications. Three processes can run at the same time. Plug-and-play functionality supports valve changes. Piezo Jet Valve provides super high speed for low viscosity. Solder Jet, Volume Displacement, Time/Pressure, and Archimedean Screw Valve are included. Full operator support is available through automated error analysis and KPI monitoring. Training, support, and troubleshooting are provided via advanced remote access. Investment protection is ensured, with all options and heads retrofittable.
| Feature | FOX1 Stand Alone / In Line | FOX2 - Stand Alone / In Line | FOX4 - Stand Alone / In Line |
|---|---|---|---|
| Optimum placement speed (1) | Chip 9’100 cph | Chip 17’500 cph | Chip 31’000 cph |
| Speed (IPC 9850) (1) | Chip 7’300 cph / QFP 6’700 cph | Chip 13’600 cph / QFP 6’700 cph | Chip 20’500 cph / QFP 9’600 cph |
| Speed (IPC 9850A) (1) | Chip 7’000 cph / QFP 5’300 cph | Chip 12’700 cph / QFP 5’300 cph | Chip 18’500 cph QFP 6’700 cph |
| Jet speed solder paste up to Shockwave valve | - Optimum (2) : 1’100’000 dots/h - Dot matrix (3) : 665’000 dots/h - Application average (4) : 350’000 dots/h | - Optimum (2) : 1’100’000 dots/h - Dot matrix (3) : 665’000 dots/h - Application average (4) : 350’000 dots/h | - |
| Jet speed glue up to Piezo valve | - Optimum (5) : 2’000’000 dots/h - Dot matrix Jet-on-the-Fly (6) :780’000 dots/h - Dot matrix Stop ‘n Jet (6) :177’000 dots/h | - Optimum (5) : 2’000’000 dots/h - Dot matrix Jet-on-the-Fly (6) :780’000 dots/h - Dot matrix Stop ‘n Jet (6) :177’000 dots/h | - |
| Dispensing speed up to (6) | - Time/pressure valve :38’000 dots/h - Archimedean screw valve :30’000 dots/h - Volume dispenser valve :26’000 dots/h | - Time/pressure valve :38’000 dots/h - Archimedean screw valve :30’000 dots/h - Volume dispenser valve :26’000 dots/h | - |
| Job changeover time | < 1 min (loading job, adjust conveyor/table, restart production) | < 1 min (loading job, adjust conveyor/table, restart production) | < 1 min (loading job, adjust conveyor/table, restart production) |
| Feature | FOX1 Stand Alone / In Line | FOX2 - Stand Alone / In Line | FOX4 - Stand Alone / In Line |
|---|---|---|---|
| Feeder System | EVO and hyQ (intelligent single feeder) CLM (intelligent cassette feeder) (*) (*) : Restrictions on FOX4 with CLM racks on front, see System Description | EVO and hyQ (intelligent single feeder) CLM (intelligent cassette feeder) (*) (*) : Restrictions on FOX4 with CLM racks on front, see System Description | EVO and hyQ (intelligent single feeder) CLM (intelligent cassette feeder) (*) (*) : Restrictions on FOX4 with CLM racks on front, see System Description |
| Feeder capacity (8mm tape) | 180 / 120 | 180 / 120 | 180 & 200(*) / 120 & 140(*) (*) : with optional Extended Rack, pick position cannot be taught with top camera |
| Feature | FOX1 Stand Alone / In Line | FOX2 Stand Alone / In Line | FOX4 Stand Alone / In Line |
|---|---|---|---|
| Components | 008004 (imp.) – 109 x 87 mm | 008004 (imp.) – 109 x 87 mm | 008004 (imp.) – 109 x 87 mm |
| Component size range | 0201 (imp.) / 40 x 40 mm: Standard | 0201 (imp.) / 40 x 40 mm: Standard | 0201 (imp.) / 40 x 40 mm: Standard |
| Component size range | Up to 87 x 35 mm: With optional MFOV(*) license | Up to 87 x 35 mm: With optional MFOV(*) license | Up to 87 x 35 mm: With optional MFOV(*) license |
| Component size range | Up to 109 x 87 mm: With opt. MFOV license and Vision Box(**) | Up to 109 x 87 mm: With opt. MFOV license and Vision Box(**) | Up to 109 x 87 mm: With opt. MFOV license and Vision Box(**) |
| Component size range | 01005 (imp.): With opt. Nozzle 0 and EVO feeder | 01005 (imp.): With opt. Nozzle 0 and EVO feeder | 01005 (imp.): With opt. Nozzle 0 and EVO feeder |
| Component size range | 008004 (imp.): With opt. Nozzle 0 and EVO feeder | 008004 (imp.): With opt. Nozzle 0 and EVO feeder | 008004 (imp.): With opt. Nozzle 0 and EVO feeder |
| Mass moment of inertia | 200 g x cm2 | 200 g x cm2 | 200 g x cm2 |
| Min. lead pitch | 0.3 mm (12mil) | 0.3 mm (12mil) | 0.3 mm (12mil) |
| Min. ball diameter / pitch | 0.2 mm | 0.2 mm | 0.2 mm |
| Min. component height | > 0.0 mm | > 0.0 mm | > 0.0 mm |
| Max. component height | Standard: 18 mm / On request other heights | Standard: 18 mm / On request other heights | Standard: 18 mm / On request other heights |
| Process height | ± 18 mm (0.71”) from zero height | ± 18 mm (0.71”) from zero height | ± 18 mm (0.71”) from zero height |
| Important Information | (*)Multi Field of View (**)Requires space up to 22 hyQ/EVO - 30 CLM Feeder lanes, front side mounting only (see System Description) | (*)Multi Field of View (**)Requires space up to 22 hyQ/EVO - 30 CLM Feeder lanes, front side mounting only (see System Description) | (*)Multi Field of View (**)Requires space up to 22 hyQ/EVO - 30 CLM Feeder lanes, front side mounting only (see System Description) |
| Feature | FOX1 Stand Alone / In Line | FOX2 Stand Alone / In Line | FOX4 Stand Alone / In Line |
|---|---|---|---|
| Linear encoder resolution XY | 0.2 μm | 0.2 μm | 0.2 μm |
| Rotation axis resolution | 0.007° | 0.007° | 0.007° |
| Overall placement accuracy XY chip | ± 40 μm (3σ) (9) | ± 40 μm (3σ) (9) | ± 40 μm (3σ) (9) |
| ± 30 μm (3σ) (9) | ± 30 μm (3σ) (9) | ± 30 μm (3σ) (9) | ± 30 μm (3σ) (9) |
| Min. PCB dimensions | 20 x 20 mm (0.8 x 0.8"") / 50 x 50mm (2 x 2"") | 20 x 20 mm (0.8 x 0.8"") / 50 x 50mm (2 x 2"") | 20 x 20 mm (0.8 x 0.8"") / 50 x 50mm (2 x 2"") |
| Max. PCB dimensions | 406 x 305 mm (16 x 12”) | 406 x 305 mm (16 x 12”) | 406 x 305 mm (16 x 12”) |
| PCB thickness | 0.5-3.5 mm (0.02 - 0.13”) / 0.5-5.0 mm (0.02 - 0.2"") | 0.5-3.5 mm (0.02 - 0.13”) / 0.5-5.0 mm (0.02 - 0.2"") | 0.5-3.5 mm (0.02 - 0.13”) / 0.5-5.0 mm (0.02 - 0.2"") |
| PCB edge clearance | 3.0-5.0 mm (0.11 – 0.2”) (varies with PCB thickness) / T: 3.0 mm (0.11”) B: 5.0 mm (0.2”) | 3.0-5.0 mm (0.11 – 0.2”) (varies with PCB thickness) / T: 3.0 mm (0.11”) B: 5.0 mm (0.2”) | 3.0-5.0 mm (0.11 – 0.2”) (varies with PCB thickness) / T: 3.0 mm (0.11”) B: 5.0 mm (0.2”) |
| Max. board weight | - / 4 kg (8.8 lb) | - / 4 kg (8.8 lb) | - / 4 kg (8.8 lb) |
| Conveyor height | - / SMEMA 940 – 965 mm | - / SMEMA 940 – 965 mm | - / SMEMA 940 – 965 mm |
| Clearance below PCB | 40 mm (1.57") / 27 mm (1.1”) | 40 mm (1.57") / 27 mm (1.1”) | 40 mm (1.57") / 27 mm (1.1”) |
| # | Important Information |
|---|---|
| 1 | Values reached using EVO and hyQ feeder type only. |
| 2 | Maximum valve frequency, using settings from solder paste Application Matrix with Jet-on-the-Fly capability (req. SW-ESP license) |
| 3 | Dot matrix 33x33 with pitch 1.0 x 1.0 mm, using settings from solder paste Application Matrix with Jet-on-the-Fly capability (req. SW-ESP license) |
| 4 | Average of 17x different industrial PCBs, using settings from solder paste Application Matrix with Jet-on-the-Fly capability (req. SW-ESP license) |
| 5 | Maximum valve frequency |
| 6 | Dot matrix 33 x 33 with pitch 0.8 x 0.8 mm, dot size 0.5mm, medium Loctite 3621 |
| 7 | Some feeder type «CSM» are also compatible. See System Description for possibilities and details. |
| 8 | Under conditions specified by Essemtec |
| 9 | Used speed mode “very accurate”, up to 3 different speed modes available. Measured with chip 0402 and glass QFP100. Only applicable at zero height and within performance temperature / humidity range. |
| Piezo Jet | Shockwave Jet | Hacimsel (Volume) | Vidalı (Screw) | Zaman-Basınç |
|---|---|---|---|---|
| SMD-Adhesives, Underfill, Silver Epoxy, UV-Adhesives, Globe Top, Encapsulation, Dielectric Ink | Solder Paste, Liquid Metal | Underfill, Gasketing, Globe Top, Dam and Fill, Solder Paste | Solder Paste, SMD-Adhesive, Globe Top, Encapsulation, Silver Epoxy, Dam and Fill | Gasketing, Globe Top, Encapsulation, Solder Paste, SMD-Adhesive, Silver Epoxy, Dam and Fill |
| Low - High Viscosity | High Viscosity | Low - High Viscosity | High Viscosity | High Viscosity |
| Max Frequency: 2’000’000 dots/h BGA Jet-on-the-Fly: 780’000 dots/h BGA Stop & Jet: 177’000 dots/h | Max Frequency: 1’100’000 dots/h BGA Jet-on-the-Fly: 665’000 dots/h Average Speed: 350’000 dots/h | 26’000 dots/h (BGA Pattern*) | 30’000 dots/h (BGA Pattern*) | 38’000 dots/h (BGA Pattern*) |
This product video introduces Fox Series by summarizing its general working principle and typical application scenarios.
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