Component Placement

Component placement brings electronic parts together on a PCB before soldering. The equipment may handle surface-mount devices, through-hole components or parts with unusual shapes, depending on the assembly design. Choosing the right placement approach starts with the components that must be handled reliably.

In SMT production, feeders supply components to pick-and-place heads, and vision systems help verify orientation and position. Through-hole and odd-form assembly can require different grippers, insertion tools and support fixtures. Placement accuracy, component handling and board stability all affect the quality of the completed assembly.

A production line should accommodate both current products and realistic future changes. Component dimensions, feeder capacity, PCB size and changeover requirements can be more informative than headline placement speed alone. Programming, material preparation and connections to upstream printing and downstream soldering equipment also influence usable capacity.

At Sinerji, you can find component placement equipment for SMT, THT and mixed-technology assembly. Share your component range and production plans with our team to explore suitable configurations.

Essemtec is a Swiss technology company developing jet printing, dispensing, and SMD pick-and-place solutions for SMT manufacturing. Its adaptive systems combine placement accuracy, speed, and micro-dispensing capability, enabling flexible and efficient electronic assembly processes that quickly adapt to evolving production requirements.