Thermal Shock Testing

Thermal shock testing subjects a sample to rapid changes between hot and cold conditions. It helps investigate stresses caused by different rates of thermal expansion within materials, components and electronic assemblies.

The test can reveal weaknesses in solder joints, interconnections and bonded structures, depending on the sample and chosen profile. Transfer time, temperature range and dwell duration influence the stress applied. The sample also needs enough time at each condition to meet the intended test requirement.

Compare chamber arrangements, usable sample space and temperature recovery under load. Fixtures should permit the required exposure without adding unintended restraint. Monitoring and inspection can be performed during or after cycling according to the test plan. Recorded profiles help explain differences between samples and establish whether the equipment achieved the specified conditions.

Find thermal shock test equipment at Sinerji. Our team can help you assess systems against your product dimensions, thermal profile and reliability evaluation requirements.