ULTRAFINE NO CLEAN SOLDER PASTE
ULTRAFINE NO CLEAN SOLDER PASTE
ULTRAFINE NO CLEAN SOLDER PASTE
NC259FPA Ultrafine No Clean Solder Paste
Solder pastes with ultra fine alloy powders, such as T6 or finer, are essential for a range of emerging and advanced applications where precision, reliability, and miniaturization are paramount.
AIM’s NC259FPA Ultrafine No Clean Solder Paste is formulated specifically for Type 6 and finer solder powders. This solder paste offers efficient transfer rates and precise print definition. The NC259FPA activator system promotes improved wetting on various surface finishes, resulting in strong shear values of up to 150 gf. It also leaves residue with high Surface Insulation Resistance (SIR) values and a clear appearance. NC259FPA is designed to deliver the tack force necessary for effective mass transfer assembly.
✔ Precise print definition with Type 6 and finer solder powder
✔ Excellent Wetting
✔ High shear strength
✔ Clear flux residue
✔ Nitrogen reflow recommended
✔ Zero halogen/halogen-free
✔ 8-hour stencil life
✔ REACH and RoHS Compliant
✔ MiniLED and MicroLED assembly
✔ Small and/or complex die attach in semiconductor assembly
✔ Micro BGA assembly
✔Any applications reliant on print apertures ≤ 70 µm
✔ Dispensing applications such as jet printing
✔ High density interconnect (HDI) boards
| Alloys | SN100C | SAC305 |
|---|---|---|
| Melting Temperatures (℃) | 227°C | 217°C -220°C |
| Peak Reflow Temperature Range (℃) | 245°C-260°C | 230°C-260°C |
| Alloy Attributes | High purity - Eutectic alloy - Low melting temperature | Excellent wetting characteristics - Compatible with all flux types |
| * | T6 powder mesh size is standard. Additional powder sizes and alloys may be available upon request. | T6 powder mesh size is standard. Additional powder sizes and alloys may be available upon request. |
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