NO CLEAN SOLDER PASTE
NO CLEAN SOLDER PASTE
NO CLEAN SOLDER PASTE
V9 Low Voiding No Clean Solder Paste
V9 Low Voiding No Clean Solder Paste is formulated for near-zero voiding on BGA, BTC and LED soldering applications. Significant void reduction is achievable on all surface finishes including
ENIG, immersion tin/silver and OSP. V9 exhibits stable print performance on fine feature devices over 12 hours.
V9 post-process residue is easily pin-probed and has high SIR values.
*lead-free alloys
✔ Low Voiding: as low as 1% on BGA and <5% on BTCs
✔ Capable of Consistent Printing with Area Ratio < 0.66
✔ High Reliability (SIR)
✔ Drop-in for M8
✔ Available in SAC305 T4
✔ REACH and RoHS Compliant*
✔ Reduced voiding aids in thermal dissipation resulting in a low junction temperature for rapid cycling devices such as LED lighting
✔ Excellent print transfer and near-zero voiding exceed strict automotive OEMs and tier 1 supplier requirements
✔ Electrochemical reliability fit for aerospace and military assemblies
✔ Wide process window: void reduction across a variety of reflow profiles
| Alloys | SAC305 |
|---|---|
| Melting Temperatures (℃) | 217°C -220°C |
| Peak Reflow Temperature Range (℃) | 230°C-260°C |
| Alloy Attributes | Excellent wetting characteristics - Compatible with all flux types |
| * | T4 powder mesh size is standard. Additional powder sizes and alloys may be available upon request. |
This product video introduces V9 by summarizing its general working principle and typical application scenarios.
English 
Türkçe