Sac305 Lead-Free Solder Alloy
SAC305 Electropure is a high purity lead-free alloy containing 96.5% tin, 3% silver, and 0.5% copper. In solid solders, AIM’s Electropure proprietary manufacturing method reduces suspended oxides creating a low drossing, strong wetting alloy.
SAC305 is widely used in hand, selective, wave and SMT soldering. SAC305 provides durable joint strength and the lowest melting point of tin/silver/copper solders.
SAC305 alloy is available in solder wire, solder bar, and solder paste.
✔ Cost Effective Sn/Ag/Cu Alloy
✔ Excellent Solder Joint Reliability
✔ Best Wetting Sn/Ag/Cu Alloy
✔ Manufactured with AIM Electropure™ Technology
✔ Global Standard Lead-Free Alloy
✔ Complies with IPC, JEDEC, RoHS, and REACH Pb-free soldering standards
✔ AIM’s Electropure technology reduces solder drossing, improves flow and reduces bridging
✔ IPC/JEIDA/IEC/EIN recommended alloy for lead-free soldering
✔ Suitable for a wide variety of applications
✔ SAC305 melting point: 217-220°C
✔ Popular in consumer and automotive applications
| Composition | Melting Temperatures (℃) | Peak Reflow Temperature (℃) | Cost Level |
|---|---|---|---|
| Sn/Ag/Cu | 217°C – 220°C | 240°C – 250°C | $$$ |