LOW TEMPERATURE ALLOY
LOW TEMPERATURE ALLOY
LOW TEMPERATURE ALLOY
Sn42/Bi57/Ag1 Low Temperature Alloy
Sn42/Bi57/Ag1 is a low melting temperature alloy with improved wetting and fatigue characteristics versus Sn42/Bi58. It is composed of 42% tin, 57% bismuth and 1% silver.
Low temperature solders require a lower peak reflow temperature than other lead-free solder alloys, reducing energy consumption and component-warpage related defects such as NWO (non-wet opens).
Sn42/Bi57/Ag1 is available with specially formulated fluxes to ensure electrochemical reliability even with reduced soldering temperatures.
✔ Manufactured with AIM Electropure™ Technology
✔ Good Fatigue Characteristics
✔ Improved Wetting
✔ Low Temp Alloy: Melting Point:138°C
✔ RoHS Compliant
✔ Complies with IPC J-STD-006
✔ Lead-free low melt alloy
✔ Low temperature solder paste reduces overall reflow profile temperature significantly lower than SAC305 (217-219℃)
✔ Reduces NOW/HiP defects on temperature sensitive components
✔ Good wetting performance required for quick, post-assembly attachments
| Composition | Melting Temperatures (℃) | Peak Reflow Temperature (℃) | Cost Level |
|---|---|---|---|
| Sn/Bi/Ag | 138°C | 235°C | $$ |
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