NO CLEAN SOLDER PASTE
NO CLEAN SOLDER PASTE
NO CLEAN SOLDER PASTE
NC273LT Solder Paste Low Temperature
AIM’s NC273LT Low Temperature Solder Paste features a revolutionary activator system that enhances wetting performance, prolongs stencil life, and achieves excellent transfer efficiencies. Additionally, it effectively minimizes solder balling, a common issue with high bismuth materials.
Low temperature solder materials like NC273LT also decrease peak reflow temperature requirements to as low as 170°C to 175°C (340°F to 350°F). This reduction in temperature leads to cost savings, lower CO2 emissions, and reduced HiP defects.
*lead-free alloys
✔ Designed for low temperature solder applications
✔ Increased wetting attributes
✔ Reduce HiP (Head-in-Pillow) defects
✔ > 8-hour long stencil life
✔ Minimize solder balling
✔ Excellent transfer efficiencies
✔ RoHS compliant
✔ Reduces BGA warpage, which minimizes HiP and NWO (Non-Wet Open) defects
✔ Lowers process temperatures for thin or temperature sensitive components
✔ Used in step soldering or second-solder reflow applications to exploit the different melting temperatures of two alloys
✔ Reduces carbon footprint and energy costs
✔ Lowers material and component costs
| Alloys | Sn42/Bi58 | Sn42/Bi57/Ag1 |
|---|---|---|
| Melting Temperatures (℃) | 138°C | 138°C- 140°C |
| Peak Reflow Temperature Range (℃) | 163°C-188°C | 163°C-188°C |
| Alloy Attributes | High purity - Eutectic alloy - Low melting temperature | High purity - Low melting temperature - Addition of Ag increases ductility |
| * | T4 powder mesh size is standard. Additional powder sizes and alloys may be available upon request. | T4 powder mesh size is standard. Additional powder sizes and alloys may be available upon request. |
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