WATER SOLUBLE SOLDER PASTE
WATER SOLUBLE SOLDER PASTE
WATER SOLUBLE SOLDER PASTE
W20 Water Soluble Solder Paste
AIM’s W20 Water Soluble Solder Paste has been developed to meet the industry’s demand for a consistently reliable zero-halogen water soluble solder paste. W20 offers enhanced wetting performance in an innovative halogen-free flux chemistry.
W20 exhibits excellent print performance with an 8+ hour stencil life while reducing voids on challenging SMT components. This all-purpose water soluble solder paste leaves post-reflow residues that are easily removed with plain or DI water, even under low stand-off devices.
W20 is formulated for use with SAC305 T4 powder and is a RoHS compliant solder paste. W20 solder paste can be combined with WS716 liquid flux and WS482 solder wire for a zero-halogen water soluble solution.
*lead-free alloys
✔ Zero halide & halogen per current Rev J-STD-004
✔ 8+ hour stencil life
✔ Low voiding on QFN and BGA’s
✔ Easy to clean residues using DI water
✔ Extended cleaning window of 2+ weeks
✔ Low foaming formulation
✔ Wide reflow process window
✔ Available in SAC305
✔ RoHS Compliant*
✔ For use in SMT applications where PCB washing is required. W20 residues are easily cleaned using DI water, even under low standoff components
✔ Provides stable print performance for the most demanding electronic assemblies
✔ Reduces overall voiding without nitrogen
✔ Post reflow residues can be cleaned easily after waiting 2 weeks after initial reflow
| Alloys | SAC305 |
|---|---|
| Melting Temperatures (℃) | 217°C -220°C |
| Peak Reflow Temperature Range (℃) | 230°C-260°C |
| Alloy Attributes | Excellent wetting characteristics - Compatible with all flux types |
| * | T4 powder mesh size is standard. Additional powder sizes and alloys may be available upon request. |
This product video introduces W20 by summarizing its general working principle and typical application scenarios.
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