Sn63/Pb37 Leaded Solder Alloy
Sn63/Pb37 Electropure™ is a high purity alloy that is composed of 63% tin and 37% lead. AIM’s Electropure proprietary method reduces oxides in the solder resulting in a low drossing, strong wetting alloy with improved flow.
Sn63/Pb37 has a melting point of 183°C (361°F) which can be used in SMT, wave, selective and hand soldering processes. Its resistance to thermal fatigue makes it preferred for military and aerospace applications.
Sn63/Pb37 is available in solder paste, solder bar, solid and cored solder wire.
✔ High Purity
✔ Manufactured with AIM Electropure™ Process
✔ Reduces Dross
✔ High Reliability
✔ Excellent Thermal Cycling Performance
✔ Exceeds IPC-J-STD-006 Specifications
✔ Excellent resistance to thermal fatigue
✔ Preferred for aerospace and military applications
✔ Eutectic alloy: bright, shiny solder joints
✔ Melting temperature: 183°C
✔ Leaded solder paste available in T4
| Composition | Melting Temperatures (℃) | Peak Reflow Temperature (℃) | Cost Level |
|---|---|---|---|
| Sn/Pb | 183°C | 205°C – 215°C | $ |