NO CLEAN CORED SOLDER WİRE
NO CLEAN CORED SOLDER WİRE
NO CLEAN CORED SOLDER WİRE
Rx18 No Clean Cored Solder Wire
RX18 No Clean Cored Solder Wire was formulated for use in automated and robotic soldering processes. Winner of Circuit Assembly’s 2019 NPI (New Product Introduction) Award, RX18 is compatible with all alloys and promotes fast wetting on all surface finishes.
RX18 flux cored wire is developed to provide improved thermal transfer and rapid solder penetration into plated through hole or surface mount interconnections while reducing voiding. It is designed with specialized packaging which ensures consistent, accurate, jam-free automatic feeding for robotic soldering.
RX18 cored solder wire’s post soldering residues are minimal, clear and pass IPC-004 current revision SIR and corrosion requirements, enabling its reliability in any application ranging from military and automotive to consumer electronic assemblies.
RX18 is available in multiple lead-free alloy options which are REACH compliant and make it the ideal RoHS solder wire for electronics assembly. It is also available in leaded alloys such as Sn63/Pb37.
*Lead-free alloys
✔ Low voids
✔ Low spatter
✔ Extends solder tip life
✔ ROL0 per IPC J-STD-004
✔ Fast wetting/feed rates
✔ Minimal/clear residues
✔ Available in leaded and lead-free alloy
✔ REACH and RoHS Compliant*
✔ Engineered for use in robotic/automated soldering processes
✔ Consistent, accurate, jam-free automatic feeding
✔ Rapid solder penetration into plated through hole or surface mount interconnections
✔ Excellent wetting
✔ Post soldering residues pass IPC-004 current revision SIR and corrosion requirements
✔ Available in multiple alloy offerings
• High reliability alloys suitable for automotive and military applications
• Low-cost SAC alternatives
| Alloys | Melting Temperatures (℃) | Alloy Attributes | * |
|---|---|---|---|
| SAC305 | 217°C -220°C | Excellent wetting characteristics - Compatible with all flux type. | 3.5% flux is standard. Additional flux percentages and diameters may be available upon request. |
| REL61 | 208°C -215°C | Enhanced reliability vs low/no-silver alloys - Low-cost alternative to SAC alloys - Improved wetting vs low/no-silver alloys | 3.5% flux is standard. Additional flux percentages and diameters may be available upon request. |
| REL22 | 210°C -219°C | High reliability for use in extremely harsh environments - Improved thermal cycling performance - Improved wetting vs low/no-silver alloys | 3.5% flux is standard. Additional flux percentages and diameters may be available upon request. |
| SN100C | 227°C | Low-cost alternative to SAC alloys - Silver-free - Bright shiny solder joints | 3.5% flux is standard. Additional flux percentages and diameters may be available upon request. |
| SAC0307 | 217°C -227°C | Low-cost alternative to SAC alloys - Excellent solder joint reliability - Fast wetting comparable to SAC305 | 3.5% flux is standard. Additional flux percentages and diameters may be available upon request. |
| Sn63/Pb37 | 183°C | Legacy alloy for electronics soldering - Mil-spec approved - Leaded alloy | 3.5% flux is standard. Additional flux percentages and diameters may be available upon request. |
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