NO CLEAN GEL FLUX
NO CLEAN GEL FLUX
NO CLEAN GEL FLUX
NC217 No Clean Gel Flux
NC217NC Paste Flux is a halide/halogen-free no clean flux designed to wet solderable electronic surfaces, components, assemblies, and substrates.
NC Paste Flux is a tacky flux that may be used for general rework of printed circuit boards and for attaching spheres to ball grid array (BGA) packages.
NC Paste Flux residues do not require removal and can be left in place with excellent electrochemical performance.
✔ Formulated for Rework and Repair
✔ Ideal for BGAs: Wide Process Window
✔ Electrically Safe Unheated
✔ ROL0
✔ Controlled Application
✔ Easy to Clean Residue
✔ Passes SIR in Raw State
✔ Ideal for BGA rework/reballing and QFN/LGA repair
✔ Residues can be left on the board after soldering
• When cleaning is required, residues can be removed using common flux removers
✔ Wide process window offers increased manufacturing flexibility
✔ Residues pass SIR without adding heat
• Ideal for automotive, medical, and aerospace applications
✔ Tin-Lead and lead-free compatible
✔ Improved heat transfer results in reduced cycle time
✔ Designed for use with soldering irons, hot air pencils, BGA rework stations, micro-ovens, and hot air units
| Flux Type | Applications | Application Method | Alloy Compatibility |
|---|---|---|---|
| ROL0 | BGA Sphere Attach Rework Component Removal | Dispense Print Dip | Pb and PB-Free |
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