SINGLE PART EPOXY
SINGLE PART EPOXY
SINGLE PART EPOXY
Underfill FF35
Underfill FF35 is a low surface tension, single component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast, and complete spread.
Underfill FF35 offers superior reliability through high Tg, low CTE, good fill, no voiding and strong adhesion. Faster throughput and higher yields are achieved through excellent capillary action, faster flow characteristics and rapid cure speeds.
This product is suitable for bare chip protection in a broad variety of small die applications and is compatible with AIM’s full line of no clean flux chemistries.
✔ Fast Flowing Capillary Action
✔ Re-workable at 120°C
✔ Compatible with No Clean Flux Residues
✔ Minimal Voiding
✔ Stable Rheology
✔ Favorable Storage Properties
✔ RoHS Compliant
✔ Improves mechanical reliability of assembly for use in harsh environments
✔ Increases drop-shock and vibration performance on SMT components
✔ Underfill FF35 may be reworked starting at 120°C (250°F)
✔ Stable viscosity throughout shelf life
| Substrate Preheat (° C) | Tg | CTE µm/(m* ° C ) | Viscosity |
|---|---|---|---|
| 40ºC-50ºC (100°F-120°F) | 55° C Typical | ✔ Before Tg – 47 Typical ✔ After Tg – 165 Typical | 500 cps |
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