VIGON PE 190A en

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When cleaning PCB assemblies, the primary goal is to remove contaminants from populated boards and hybrid circuits resulting from fluxes and improper handling. The use of engineered PCB cleaning solutions is essential to ensure flux residues are fully removed from the assemblies used in high-reliability applications and industries such as automotive, medical, aerospace, and military.

The targeted use of a cleaning agent substantially improves the integrity of subsequent processes such as bonding and conformal coating. Residues can cause improper adhesion of bonds that can lead to failures such as heel cracks or lift-offs. During the coating process, remaining residues can result in poor wetting and delamination that can cause assembly failures and ultimately lead to field failures.

These reliability risks are increased when using lead-free solder pastes as they contain more resins as well as aggressive activator systems and are soldered at higher temperatures.

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VIGON PE 190A, based on the MPC Technology (Micro Phase Cleaning), is a water-based, alkaline cleaning agent specifically developed for the use in spray-in-air equipment. VIGON PE 190A removes flux residues from PCBs as well as power electronics including leadframes, discrete devices, power modules, and power LEDs. The cleaning agent provides exceptional results removing oxidation and stains from copper surfaces while ensuring material compatibility in preparation for subsequent processes such as wire/adhesive bonding and molding.

Advantages compared to other cleaners:

Excellent defluxing performance for PCBs and power electronics with low-standoff components
Exceptional cleanliness results with heavily oxidized and stained Cu surfaces
Retains activated copper surfaces over an extended period of time without risk of reoxidation
Broad material compatibility with sensitive metals and dies
No flash point, thus applicable in all non-explosion proof spray-in-air equipment