The Heller Industries PCO 700S is a pressure curing oven (PCO) which eliminates voids and maximizes adhesion strength in applications such as: die attach with film (DAF) or tape curingi, epoxy curing, underfill curing, wafer lamination curing, and via curing.

The PCO 700S pressurizes a rigid chamber (up to 8 kgf/cm²) with either air or Nitrogen while using forced convection heating to maintain a curing thermal profile (up to 200°) with exceptional temperature uniformity.

Vacuum functionality (down to 10 Torr) provides versatility and can be used for enhanced void removal or to achieve shorter cycle times.


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