Acoustic inspection systems use ultrasound to examine internal interfaces in electronic components and packages. Scanning acoustic microscopy can reveal features such as delamination, voids and bonding irregularities that may be difficult to assess with surface inspection alone.
The technique is particularly relevant to layered structures, encapsulated devices and bonded materials. Acoustic response varies at material interfaces, allowing suitable systems to form images of internal conditions. Sample compatibility, access and the required coupling method must be assessed before choosing this approach.
Resolution, penetration and inspection depth need to be balanced for the package being examined. A consistent scanning setup and appropriate reference samples help analysts interpret the results. Acoustic inspection may complement X-ray or other methods when different types of internal defects need to be investigated. Sample preparation and handling should preserve the condition that the analysis is intended to assess.
Find acoustic inspection systems at Sinerji. Our team can help evaluate ultrasonic inspection options for your electronic packages and internal-interface analysis requirements.
Nordson Test & Inspection is a global provider of advanced inspection and metrology solutions for SMT and semiconductor manufacturing. Its acoustic, optical, and X-ray technologies enable high-precision quality control across production processes. Supported by strong application expertise and global service teams, Nordson helps manufacturers improve process reliability and performance.
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